Epson NS8080MS IC Test Handler

Design to Deliver Higher Performance and Throughput for All Your Testing Needs

High throughput to support the testing of smartphone, tablet PC and automotive chips even in the most extreme production environments.

Tổng quát

Blazing Fast Speeds

Enjoy high-speed transfer, testing and sorting of chip packages of 13,500 chips per hour with a contact force of up to 240kgf.

Extreme High-temperature Support

Test chips at temperatures as high as 155°C and easily recover from jams during high-temperature use.

Support for Wide Socket Pitches

With a layout that accommodates even wide socket pitches, conveniently test large numbers of chips, including high-frequency (RF) chips.

Đặc điểm

Devices Handled:

Devices Handled: QFP, TSOP, CSP, WLCSP, BGA, QFN, PLCC, LGA, PGA
Min. 3 x 3 to Max. 50 x 50 (Lead pitch: 0.4mm or more) *1

Test Mode:

Test Mode: 8-site (4 x 2)
Square 4-site (2 x 2)
In-Line 4-site (4 x 1)
2-site
Single

Testing Area:

Testing Area: 264 x 149 mm

Standard Socket Pitch (mm):

Standard Socket Pitch (mm): X: 40 Y: 60

Heating Method:

Heating Method: Heating Plate

Index Time:

Index Time *2 (common in Ambient and High Temperature modes): 0.42 sec (up to 160 kgf)*2
0.58 sec (up to 240 kgf)*2

Max. Contact Force:

Max. Contact Force: 240 kgf

Maximum Throughput (units per hour):

Ambient Temperature: 13,500 unitsHigh Temperature: 8,200 units

Binning:

Binning: Max. 6 bins (Auto 3, Manual 3)

Tray:

Tray: JEDEC (135.9 x 315.0 mm)

Temperature Accuracy:

Temperature Accuracy: 50 - 90°C ±2°C
90 - 155°C ±3°C

Handler Dimensions (D x W x H):

Handler Dimensions (D x W x H): 1,500 x 1,860 x 2,000 mm *3

Weight:

Weight: 1,090kg

Power Requirements:

Rated Voltage/Frequency/Current: Single Phase 200 - 240 V AC, 50/60 Hz, 6 kVA

Xem đầy đủ đặc điểm Giấu hết đặc điểm

Print All Specs